This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities. | Manufacturing Challenges in Electronic Packaging by Y. C. Lee, Hardcover | Indigo Chapters | Manufacturing Challenges in Electronic Packaging by Y.C. Lee, Hardcover | Indigo Chapters