Home
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds by Harjinder Singh, Paperback | Indigo Chapters
Loading Inventory...
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds by Harjinder Singh, Paperback | Indigo Chapters
From Harjinder Singh
Current price: $50.50
![Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds by Harjinder Singh, Paperback | Indigo Chapters](https://dynamic.indigoimages.ca/books/9786139858248.jpg?scaleup=true&width=600&quality=85&lang=en)
![Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds by Harjinder Singh, Paperback | Indigo Chapters](https://dynamic.indigoimages.ca/books/9786139858248.jpg?scaleup=true&width=600&quality=85&lang=en)
From Harjinder Singh
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds by Harjinder Singh, Paperback | Indigo Chapters
Current price: $50.50
Loading Inventory...
Size: 0.14 x 9 x 0.22
*Product information may vary - to confirm product availability, pricing, shipping and return information please contact Coles
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds by Harjinder Singh, Paperback | Indigo Chapters